Mini-LED 光學(xué)檢測(cè)機(jī)(Optical Inspector)解決超微晶片不足0.1毫米，體積小、布局密，質(zhì)檢難度極高的難題；該設(shè)備采用高分辨率相機(jī)和AI增強(qiáng)算法，能夠準(zhǔn)確檢測(cè)出偏移、錫膏、亮度、缺焊等10多種缺陷特征；同時(shí)進(jìn)行外觀檢測(cè)與點(diǎn)亮檢測(cè)，漏檢率小于0.1%，檢測(cè)精度優(yōu)于5um，檢測(cè)速度2000mm2/秒。
可檢測(cè)最小3*5mil芯片 / Can detect 3*5 mil chips.
支持單板超10萬(wàn)顆芯片 / Supports single-board over 100,000 chips.
爐前爐后外觀檢測(cè) / Pre-bake and post-bake opticalinspection.
少件、偏位、固翻、異物、旋轉(zhuǎn)、重疊、立碑、浮高、缺件、多件
Missing part, misalignment, flipped components, foreign objects, rotation, overlap, tombstoning, lifted components, multiple components.
檢測(cè)陣列自動(dòng)生成，自動(dòng)修正。多點(diǎn)測(cè)高，自動(dòng)補(bǔ)償高度差
Automated generation and correction of detection arrays. Multi-point height measurement with automatic compensation for height differences.
專利光源配合高分辨率鏡頭，捕捉超微缺陷
Patented light source combined with high-resolution lenses to capture ultra-fine defects.
解決超微晶片不足0.1毫米，體積小、布局密，質(zhì)檢難度極高的難題。
Solving the challenge of inspecting ultra-small chips, less than 0.1 miimeters in size, with small volume and dense layout, presents an extremely high difficulty in quality inspection.
采用高分辨率相機(jī)和AI增強(qiáng)算法，能夠準(zhǔn)確檢測(cè)出偏移、錫膏、亮度、缺焊等10多種缺陷特征。
By employing high-resolution cameras and Al-enhanced algorithms, the system can accurately detect over 10 types of defect features including misalignment, solder paste. brightness, and solder voids.
同時(shí)進(jìn)行外觀檢測(cè)與點(diǎn)亮檢測(cè)，漏檢率小于0.1%，檢測(cè)精度優(yōu)于5um，檢測(cè)速度2000mm2/秒。
Simultaneous appearance and illumination inspection, with a false negative rate of less than 0.1%, detection accuracy better than 5um, achieving a detection speed of 2000 mm2/second.
